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Hardware Engineer

Responsibilities

1.Design and test hardware circuits for optical engine chips. 2.Evaluate application solutions for optical engine chips, design peripheral application circuits, and perform testing in customer application environments. 3.Prepare technical documentation such as product manuals and application guides for optical engine chips.

Requirements

1.Bachelor’s degree or higher in Electronics, Microelectronics, or a related field (full-time education preferred). 2.Proficient in hardware design and testing, with strong investigative and research skills. 3.Passion for learning, curiosity about new technologies, and a proactive approach to skill development; responsible, innovative, and thrives in a startup-like team environment. 4.Familiarity with Ethernet PHY, PCIe PHY, or optical modules is a plus. Location: Shanghai Headcount: 1

Firmware Engineer

Responsibilities

1.Develop firmware for optical engine modules. 2 .Develop PC-side software applications for testing optical engine modules. 3.Provide firmware development support during customer integration of optical engine modules.

Requirements

1.Bachelor’s degree or higher in Software, Embedded Systems, or a related field (full-time education required). 2.Familiarity with firmware/embedded software development. 3.Strong investigative and research skills. 4.Passion for learning, curiosity about new technologies, and a proactive approach to skill development; responsible, innovative, and thrives in a startup-like team environment. 5.Familiarity with protocols such as PCIe and Ethernet is a plus. Location: Shanghai Headcount: 1

Systems Engineer

Responsibilities

1.Translate and decompose customer technical requirements; design internal system solutions and architecture, and define performance metrics. 2.Develop and simulate system models for optical interconnect chip links, including circuits, packaging, and optical modules. 3.Identify and resolve system-level issues during the development of optical interconnect chip modules.

Requirements

1.Bachelor’s degree or higher in Electronics, Communications, or related fields (full-time education preferred). 2.Familiarity with communication principles, modeling, simulation, and system design of communication links. 3.Passion for learning, curiosity about new technologies, and a proactive approach to skill development. 4.Responsible, innovative, and thrives in a startup-like team environment. Location: Shanghai Headcount: 1

Optoelectronic Device Process Integration Engineer

Responsibilities

1.Develop optoelectronic process platforms: Lead silicon photonics (SiPh), III-V compound (InP/GaAs), and heterogeneous integration optoelectronic device process development; optimize performance of core devices such as waveguides, modulators, and detectors. 2.Device-process co-optimization: Lead process-device collaboration to improve electrical/optical characteristics through key process parameter adjustments (e.g., doping, etching, epitaxial growth). 3.Heterogeneous integration breakthroughs: Develop bonding processes for silicon-photonics and III-V heterogeneous integration, including Die-to-Wafer and hybrid bonding; support CPO (Co-Packaged Optics) applications. 4.Facilitate process transfer from R&D to mass production, establish process specifications, and improve yield.

Requirements

1.Master’s degree or higher in Optoelectronic Engineering, Semiconductor Physics, Microelectronics, or a related field. 2.Familiarity with full-process manufacturing of silicon photonic devices (e.g., waveguides/grating couplers) or III-V photonic devices (e.g., lasers/detectors). Location: Shanghai Headcount: 1

Device Engineer

Responsibilities

1.Participate in process development and performance optimization of optoelectronic devices (e.g., lasers, modulators, detectors); assist in experimental design and data analysis. 2.Learn and master the operation and process debugging of semiconductor process equipment (e.g., lithography, etching, thin-film deposition). 3.Assist the team in simulation, fabrication, and testing of silicon photonics (SiPh) or III-V optoelectronic devices.

Requirements

1.Master’s degree or higher in Optoelectronics, Microelectronics, Physical Electronics, Materials Science, or a related field. 2.Familiarity with semiconductor physics and principles of optoelectronic devices (e.g., lasers, waveguides, photodetectors). Basic knowledge of semiconductor processes (e.g., lithography, etching, thin-film growth) or device simulation tools (e.g., Lumerical, COMSOL) is required.   Location: Shanghai Headcount: 1

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