Campus Recruitment
Mechanical Structure Engineer
Responsibilities
1. Perform mechanical structure design, thermal and stress simulation for CPO/NPO silicon photonics products; study impact of mechanical structure on optical system and product performance.
2. Design mechanical structure, parts, and material selection.
3. Work with optical chip, optical, advanced packaging, and hardware engineers on design, verification, debug, and repair.
4. Plan and execute structure design; meet milestones with quality and cost control.
5. Prepare BOM, drawings, technical standards, and user documentation.
6. Support structure and process improvement over product life; explore and apply new and automated processes.
Requirements
1. Full-time bachelor’s degree or above in mechanical or related field.
2. Experience in silicon photonics or optical communications device design and verification preferred.
- Location: Shanghai
- Headcount: 1
Silicon Photonics Device Design Engineer
Responsibilities
1. Design and optimize silicon photonics active and passive devices.
2. Plan tape-outs and create layouts.
3. Define test plans; process and analyze test data.
Requirements
1. Full-time master’s degree or above; preference for optical engineering, optoelectronics, microelectronics, or physical electronics.
2. Proficient in Lumerical, Comsol, Sentaurus, etc.; familiar with test methods and equipment for high-speed silicon photonics devices.
3. Experience with high-speed devices (e.g., MZM, PD) preferred.
4. Strong learning agility, curiosity, responsibility, and initiative; comfortable in a startup team.
- Location: Shanghai
- Headcount: 2
Silicon Photonics Process Engineer
Responsibilities
1. Work with internal device design and external foundries on silicon photonics development and process evaluation.
2. Participate in tape-out process definition and process R&D to reduce defects and improve stability and yield.
3. Track manufacturing; identify, analyze, and resolve process issues.
4. Support NTO process assessment and risk mitigation.
Requirements
1. Full-time master’s degree or above in microelectronics, optoelectronics, materials, or physics; familiar with silicon photonics device physics.
2. At least 2 years of silicon photonics TD/PIE/PE/Device experience; optical communications/data center preferred.
3. Familiar with chip fabrication and silicon photonics process; modulator, detector, or low-loss waveguide experience preferred.
4. Strong teamwork, self-drive, and analytical problem-solving.
- Location: Shanghai
- Headcount: 1
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