Campus Recruitment
DFB Design Engineer
Responsibilities
1.DFB laser device design:
(1)Design and optimize high-power DFB laser devices, including active regions, grating structures, waveguides, etc.
(2)Perform optical and electrical performance simulation using tools such as Lumerical, COMSOL, Sentaurus.
(3)Design epitaxial structures and process parameters; optimize device performance including power, efficiency, and reliability.
2.Integration & testing:
(1)Lead laser device and optical path integration; ensure stability and reliability in subsystems.
(2)Design and execute device CP and FT test plans; validate device and system performance.
(3)Analyze test data, propose improvements, and iterate on design.
3.Cross-functional collaboration:
(1)Work with process engineers to ensure design for manufacturability and resolve process-related issues.
(2)Collaborate with partners on device and process integration to achieve industry-leading laser and subsystem performance with volume-production capability.
(3)Work with system architects and product managers to define product specifications and performance targets.
(4)Support the product from prototype through volume production.
4.R&D and innovation:
(1)Track latest developments in silicon photonics integration; explore new technologies and materials for optical interconnect applications.
(2)Contribute to patent drafting and technical documentation; drive company innovation.
Requirements
1.Master’s or PhD in Optical Engineering, Electronic Engineering, Physics, or related field.
2.3+ years of laser device design or semiconductor optoelectronic device design; volume production experience preferred; familiarity with silicon photonics heterogeneous integration is a plus.
3.Proficiency in optical simulation tools (e.g. Lumerical, COMSOL, OptiBPM, Sentaurus).
4.Familiarity with III–V semiconductor epitaxy and process technology.
5.Familiarity with Python, MATLAB, or similar for data analysis and automated testing.
6.Strong communication and teamwork; ability to work effectively with cross-functional teams.
7.Strong problem-solving and innovation mindset; ability to perform under pressure.
DFB Process Engineer
Responsibilities
1.Lead full process development and ramp for distributed feedback laser (DFB) chips, covering epitaxial handling, lithography, etch, coating, cleaving, packaging, etc.; define process flows and SOPs; drive new products from pilot to volume production.
2.Optimize process parameters; address wavelength drift, high threshold current, reliability issues, etc.; use SPC and DOE to control process variation and improve yield and performance stability.
3.Prepare and maintain process documentation (FMEA, control plans, work instructions); work with quality on failure analysis, root cause (e.g. overlay, coating adhesion) and closed-loop improvement.
4.Support new equipment qualification and new material evaluation with R&D and equipment teams; provide technical support to production; organize technical training for DFB support skills.
Requirements
1.Lead full process development and ramp for distributed feedback laser (DFB) chips, covering epitaxial handling, lithography, etch, coating, cleaving, packaging, etc.; define process flows and SOPs; drive new products from pilot to volume production.
2.Optimize process parameters; address wavelength drift, high threshold current, reliability issues, etc.; use SPC and DOE to control process variation and improve yield and performance stability.
3.Prepare and maintain process documentation (FMEA, control plans, work instructions); work with quality on failure analysis, root cause (e.g. overlay, coating adhesion) and closed-loop improvement.
4.Support new equipment qualification and new material evaluation with R&D and equipment teams; provide technical support to production; organize technical training for DFB support skills.
- Location: Shanghai
- Headcount: 1
Silicon Photonics Device Design Engineer
Responsibilities
1.Design and optimize silicon photonics active and passive devices.
2.Plan silicon photonics tape-outs and create layouts.
3.Define chip test plans; process and analyze test data.
Requirements
1.Full-time Master’s or above; Optical Engineering, Photonics, Microelectronics, or Physical Electronics preferred.
2.Proficiency in Lumerical, Comsol, Sentaurus; familiarity with test methods and equipment for high-speed silicon photonics devices.
3.Experience with high-speed devices such as MZM or PD is a plus.
4.Curiosity for new technology, sense of responsibility, entrepreneurial spirit, and comfort in a startup-style environment.
- Location: Shanghai
- Headcount: 2
Silicon Photonics Process Engineer
Responsibilities
1. Work with internal device design and external foundries on silicon photonics development and process evaluation.
2. Participate in tape-out process definition and process R&D to reduce defects and improve stability and yield.
3. Track manufacturing; identify, analyze, and resolve process issues.
4. Support NTO process assessment and risk mitigation.
Requirements
1. Full-time master’s degree or above in microelectronics, optoelectronics, materials, or physics; familiar with silicon photonics device physics.
2. At least 2 years of silicon photonics TD/PIE/PE/Device experience; optical communications/data center preferred.
3. Familiar with chip fabrication and silicon photonics process; modulator, detector, or low-loss waveguide experience preferred.
4. Strong teamwork, self-drive, and analytical problem-solving.
- Location: Shanghai
- Headcount: 1
Hardware Engineer
Responsibilities
1.Design and test hardware circuits for optical engine chips.
2.Evaluate optical engine application solutions; design application circuits and perform testing in customer application environments.
3.Prepare product manuals, application notes, and related technical documentation.
Requirements
1.Full-time Bachelor’s or above; Electronics, Microelectronics, or related discipline preferred.
2.Strong hardware design and test skills; good research and investigation ability.
3.Eager to learn; curiosity for new technology; sense of responsibility and entrepreneurial spirit; comfort in a startup-style environment.
4.Familiarity with Ethernet PHY, PCIe PHY, or optical modules is a plus.
- Location: Shanghai
- Headcount: 1
Firmware Engineer
Responsibilities
1.Develop firmware for optical engine modules.
2.Develop host software for optical engine module testing.
3.Provide firmware development support during customer integration.
Requirements
1.Full-time Bachelor’s or above in Software, Embedded Systems, or related field.
2.Familiarity with firmware / embedded software development.
3.Strong research and investigation ability.
4.Eager to learn; curiosity for new technology; sense of responsibility and entrepreneurial spirit; comfort in a startup-style environment.
5.Familiarity with PCIe, Ethernet, or related protocols is a plus.
- Location: Shanghai
- Headcount: 1
System Engineer
Responsibilities
1.Translate and decompose customer technical requirements; design internal system architecture and define specifications.
2.Build and simulate optical interconnect chip link system models (circuit, package, optics).
3.Identify and resolve system-level issues during optical interconnect module development.
Requirements
1.Full-time Bachelor’s or above; Electronics, Communications, or related discipline preferred.
2.Familiarity with communication principles and link modeling, simulation, and system design.
3.Eager to learn; curiosity for new technology; sense of responsibility and entrepreneurial spirit; comfort in a startup-style environment.
- Location: Shanghai
- Headcount: 1
Signal Integrity Engineer
Responsibilities
1.Perform signal integrity simulation, evaluation, and optimization for high-speed optical interconnect links (I/O, package, PCB).
2.Identify and resolve signal integrity issues during optical interconnect module development.
Requirements
1.Full-time Bachelor’s or above; Electronics, Communications, or related discipline preferred.
2.Familiarity with communication principles and high-speed interconnect design (PCB, package, chip).
3.Eager to learn; curiosity for new technology; sense of responsibility and entrepreneurial spirit; comfort in a startup-style environment.
- Location: Shanghai
- Headcount: 1
Mechanical Structure Engineer
Responsibilities
1. Perform mechanical structure design, thermal and stress simulation for CPO/NPO silicon photonics products; study impact of mechanical structure on optical system and product performance.
2. Design mechanical structure, parts, and material selection.
3. Work with optical chip, optical, advanced packaging, and hardware engineers on design, verification, debug, and repair.
4. Plan and execute structure design; meet milestones with quality and cost control.
5. Prepare BOM, drawings, technical standards, and user documentation.
6. Support structure and process improvement over product life; explore and apply new and automated processes.
Requirements
1. Full-time bachelor’s degree or above in mechanical or related field.
2. Experience in silicon photonics or optical communications device design and verification preferred.
- Location: Shanghai
- Headcount: 1
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