Product Solutions

Photonic integration will deliver the next "Moore's Law" in optical interconnect. Nvision is driving this effort for the next generation high bandwidth, low latency and low energy-consumption CPO/OIO optical engines. Through photonic integration, we aim to unleash unlimited interconnect bandwidth for AI era.

• AOC
• CPO/OIO

“Lighthop” PCIe Active Optical Cable

Core Technology Roadmap

The AOC product series is designed for PCIe interconnect applications with low-power and low-cost design. It complies with the SFF-TA-1032 standard, supports PCIe 6.0 x16 lane and earlier version PCIe protocols, and is compatible with the CXL 3.0 protocol. This enables a long-distance, low-power, and low-cost optical interconnect solution for inter-cabinet server connections and memory pooling applications.

Target Markets

Data Centers: High-bandwidth, long-distance interconnect between GPUs / CPUs / Memory resources within and across racks, enabling larger-scale computing clusters. High-Performance Computing (HPC): High-speed communication between compute / acceleration / switch / storage/ network nodes, supporting resource disaggregation and storage pooling applications.

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  Long interconnect distance up to 10 m
  (compared to copper cables)

• 

  High bandwidth density

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  Low transmission latency

• 

  Low cost

• 

  Low power consumption

• 

  High reliability

• 

  Supports PCIe & CXL protocols

• 

  Supports long-distance transmission of "Sideband Signals"

Product Specifications

• Supported Protocol
  PCIe 6.0 / PCIe 5.0
• Products
  AOC
• Form Factor
  CDFP (SFF-TA-1032)
• Number of Lanes
  16

• Data Rate per Lane
  64 Gbps
• Interconnect Distance
  < 20 m
• Power Consumption (per end)
  < 9.5 W
• Sideband Support
  Support

• Management Interface
  CMIS V5.2
• BER
  Pre-FEC，< 1e - 6 Post-FEC，< 1e - 12
• Latency
  < 1ns + ToF

3.2T 2.5D-Packaged CPO，External Laser Source

Core Technology Roadmap

Leveraging advanced wafer-level heterogenuous bonding techniques, we integrate compound materials, silicon photonics and CMOS ICs to form 2.5D and 3D CPO (Co-Packaged Optics) and OIO (Optical I/O). This breaks through the limitations on traditional optical modules with discrete devices; achieves high-density, low-power and large-bandwidth simultanouesly with opto-electronic co-design.

Target Markets

Targeting the billion-dollar data-center optical interconnect market (scale-up and scale-out AI clusters, ≤500 meters), addresses the "high power consumption" and "high cost" challenges of high-speed optoelectronic interfaces, speed-up next-generation computing infrastructure.

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  Long interconnect distance

• 

  High integration density

• 

  Scalability

• 

  High performance

• 

  CMOS chip ecosystem

CPO

3.2T 2.5D-Packaged CPO，External Laser Source

OIO

3.2T 3D-Packaged OIO，On-chip Laser

About Nvision

Nvision Technology is a global company specializing in photonics integration. We strive to deliver high-performance silicon photonics integration with 2.5D and 3D advanced packaging for data center optical interconnect and other applications.

Our technologies combine the cost-effectiveness of silicon ASICs with the high-integrated photonics, making it widely applicable in data centers, artificial intelligence (AI), and other fields. This significantly enhances data transmission efficiency while effectively reducing system power consumption. Built on a platform of heterogeneous integration, we combine electronic chips (silicon-based) and photonic chips (compound materials) and integrate them into 2.5D and 3D solutions. We focus on emerging applications such as AI data-center optical interconnect and infrared detectors. Nvision as "New Vision"!

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Join Nvision

Meet Nvision team, as we are a young and dynamic team of top talents such as Tsinghua University, Peking University, Nanjing University, University of Science and Technology of China and Huazhong University of Science and Technology; we also have many years of industry experience developing high-volume photonic products in optical communications, LiDARs, 3D sensing fields. We serve globally prominent customers in data centers, servers, switches, and XPUs. "Advancing the Next Generation of Moore's Law Through Photonic-Electronic Integration"— we collaborate with industry partners to drive the next wave of Moore's Law.

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