Professional Recruitment

1.Perform signal integrity simulation, evaluation, and optimization for high-speed optical interconnect links, including I/O, packaging, and PCB components. 2.Troubleshoot and resolve signal integrity issues during the development of optical interconnect chip modules.

1.Develop firmware for optical engine modules. 2.Develop PC-side software applications for testing optical engine modules. 3.Provide firmware development support during customer integration of optical engine modules.

1.Perform structural design for optical engine modules. 2.Evaluate assembly processes for optical engine modules. 3.Manage product introduction and mass production of optical engine modules at assembly plants.

1.Design epitaxial structures for electro-absorption modulators (EAM) in silicon-photonics and III-V heterogeneous integration chips. 2.Develop electrode designs and back-end processes for heterogeneously integrated EAMs. 3.Manage packaging, testing, and data analysis for EAM samples post-fabrication.

1.Develop and maintain new suppliers; collaborate with sales/PM to create forecasts and manage the full PR-PO-payment cycle. 2.Manage supplier contracts, including reviewing payment terms, penalty clauses, and negotiations. 3.Coordinate with finance to handle three-way matching (PO/receipt/invoice). 4.Dynamically monitor raw material inventory levels and initiate replenishment orders in a timely manner. 5.Manage finished goods inventory turnover; provide weekly alerts for stagnant materials. Build and maintain supply chain systems to ensure complete and smooth data flow. 6.Lead customs clearance and tax rebates for imported materials; minimize impact of imported materials on work order cycles.

1.Translate and decompose customer technical requirements; design internal system solutions and architecture, and define performance metrics. 2.Develop and simulate system models for optical interconnect chip links, including circuits, packaging, and optical modules. 3.Identify and resolve system-level issues during the development of optical interconnect chip modules.

1.Evaluate and design fiber coupling solutions for optical interconnect chips, and perform related optical simulations. 2.Manage the introduction and mass production of optical components at manufacturing partners. 3.Develop optical coupling processes and evaluate coupling performance.

1.Perform thermal design for optoelectronic chips and modules to meet product requirements. 2.Conduct thermal simulations, thermal resistance testing, and散热优化 (heat dissipation optimization) for optoelectronic chips and modules.

1.Design and test hardware circuits for optical engine chips. 2.Evaluate application solutions for optical engine chips, design peripheral application circuits, and perform testing in customer application environments. 3.Prepare technical documentation such as product manuals and application guides for optical engine chips.

1.Evaluate packaging solutions for optoelectronic chips, including traditional packages (e.g., QFN, BGA) and advanced packages (e.g., 2.5D, 3D). 2.Conduct thermal, mechanical stress, and signal integrity evaluations for product packaging. 3.Assess OSAT (Outsourced Semiconductor Assembly and Test) partners and manage new product introductions at OSATs, including key process development, new product introduction, and mass production quality control.

1.Lead process development for 3D packaging, Fan-Out Wafer Level Packaging (FOWLP), and Chiplet heterogeneous integration. 2.Develop TCB/HB wafer-level mass production solutions and address process bottlenecks such as warpage control and coplanarity. 3.Optimize key process parameters, including TSV (Through-Silicon Via), micro-bump (μBump), and RDL (Redistribution Layer). 4.Evaluate performance of advanced packaging materials and source corresponding equipment; lead new product process validation. 5.Familiarity with new product development process tools such as IPD. 6.Collaborate with design teams to communicate DFM (Design for Manufacturability) rules with suppliers. 7.Analyze failure modes related to advanced packaging processes; lead FA analysis and closed-loop improvements to enhance product reliability.

1.Design and optimize high-power DFB laser devices, including active regions, grating structures, and waveguides. 2.Perform optical and electrical simulations using tools such as Lumerical, COMSOL, and Sentaurus. 3.Design epitaxial structures and process parameters to optimize device performance (e.g., power, efficiency, reliability). 4.Integrate laser devices with optical paths to ensure stability and reliability within subsystems. 5.Design and execute CP and FT test plans to validate device and system performance. 6.Collaborate with process engineers to ensure design manufacturability and resolve process-related issues. 7.Contribute to patent applications and technical documentation to drive technological innovation.

1.Develop optoelectronic process platforms: Lead silicon photonics (SiPh), III-V compound (InP/GaAs), and heterogeneous integration optoelectronic device process development; optimize performance of core devices such as waveguides, modulators, and detectors. 2.Device-process co-optimization: Lead process-device collaboration to improve electrical/optical characteristics through key process parameter adjustments (e.g., doping, etching, epitaxial growth). 3.Heterogeneous integration breakthroughs: Develop bonding processes for silicon-photonics and III-V heterogeneous integration, including Die-to-Wafer and hybrid bonding; support CPO (Co-Packaged Optics) applications. Facilitate process transfer from R&D to mass production, establish process specifications, and improve yield.

1.Test various optoelectronic devices in silicon-photonics and III-V heterogeneous integration chips. 2.Select and use non-self-developed chips in system architectures. 3.Communicate with customers and provide technical support.