Nvision (Xi’an) Technology Co., Ltd. (“Nvision Technology”), a company specializing in optoelectronic heterogeneous integration, recently announced that it has completed a tens of millions of RMB angel funding round, exclusively invested by CAS Star. The proceeds will be used primarily to accelerate the industrialization of its wafer-level heterogeneous integration technology and overcome bottlenecks in traditional optical modules—such as low integration, large size, high power consumption, and high cost—in artificial intelligence and data center applications.
With the rapid advancement of AI and exponential growth in data volume, traditional copper cables and optical modules can no longer meet the increasing demand for interconnect bandwidth. Optical I/O (OIO) is emerging as a new paradigm for high-speed data transmission and is currently experiencing rapid development.
Nvision Technology possesses unique and advanced wafer-level optoelectronic heterogeneous integration capabilities and focuses on developing optical I/O (OIO) products and infrared detectors. The company’s technology integrates III-V materials into silicon-based semiconductor processes, combining the cost and scaling benefits of silicon (“Moore’s Law”) with the high-bandwidth advantages of photonics. It aims to achieve breakthrough performance metrics in optical interconnects, including a bandwidth density of up to 10,000 (Gbps/mm²)/(pJ/b), energy efficiency of ~1 pJ/b @ 3.2T, and latency below 5ns plus time-of-flight (TOF). These capabilities offer significant advantages over competing technologies, enabling superior solutions for performance-critical applications such as data centers, high-performance computing, 5G communications, and AI.
Founder Nie Hui brings 30 years of experience in optoelectronic devices. He previously held technical and management positions at international leading companies including Lucent Bell Labs and Intel, where he led multiple project teams and startup initiatives. The core team consists mainly of experts from Intel and top lidar companies, with extensive practical experience in R&D and mass production of photonic devices. They have successfully achieved from-scratch breakthroughs in key technologies such as 100G silicon photonics chips, high-power VCSELs, high-sensitivity SPADs, and silicon photonics-based lidar chips—all of which have passed validation in high-volume manufacturing and customer delivery.
Nvision’s ultimate goal is to incorporate compound photonic materials into the Moore’s Law trajectory through optoelectronic co-design and co-manufacturing. By leveraging wafer-level heterogeneous integration in CMOS-compatible production lines, the company aims to fabricate optical transceivers and detectors and achieve wafer-scale integration with electronic chips—potentially revolutionizing the current industry ecosystem of optical chips (based on compound materials) .
As the investor in this round, CAS Star commented: “Optoelectronic integration is a major trend in the information industry. With expanding demands from AI in sensing, communication, and computing, heterogeneous photonic integration represents a viable technological path and a key focus for our investment. We are confident in Nvision’s team given their extensive background in III-V photonics and silicon photonics, as well as their proven execution in integrated photonics—which strongly supports their innovative potential in optical I/O and infrared sensing. In addition, Nvision can closely bond with CAS Star’s ecosystem in the optoelectronic semiconductor industry and hold promising potential for application expansion. Hence, we firmly support the company and are providing substantial support including access to advanced fabrication platforms. We look forward to Nvision delivering exceptional heterogeneous integration solutions to the industry.”
