NVISION | Silicon Photonics, Photonic Integration & Datacenter Optical Interconnect Solutions
Product Solutions
AI demands for the next chapter of "Moore's Law" in data interconnects. With the core technologies in silicon photonics and advanced packaging, Nvision provides complete solutions for optical interconnects. Our solution offerings include: silicon photonic integrated chips (PICs) for optical modules, PICs for NPO, and 3D packaged CPO / OIO optical engines.
Core Advantages
End-to-End Silicon Photonics Platform
Full-Stack Capabilities in Silicon Photonics Design, Process Integration, and Testing
Our end-to-end capabilities cover silicon photonic chip design, process development, testing and validation, and performance optimization, from device-level design to system-level applications.
Advanced Packaging
3D Advanced Packaging Platform with Optoelectronic Heterogeneous Integration
Breaking through the limits of conventional packaging, we enable high-density integration of PICs, EICs, and chiplets, delivering solutions with high integration density, high performance, high reliability, low power consumption, and low cost.
Fully Domestic Supply Chain
Industry-Leading Domestic Foundries and Advanced Packaging OSATs
Together with a top-tier manufacturing ecosystem, we build scalable high-volume production capability and a fully domestic supply chain.
Application Scenarios
NPO / CPO Optical Interconnects for GPUs / ASICs
NPO / CPO / OIO optical engines deployed adjacent to GPUs / XPUs provide high-bandwidth, low-latency, and low-power consumption chip-scale optical interconnects for AI cluster scale-up fabrics, overcoming the bottlenecks of conventional electrical interconnects and unlocking the bandwidth potential of AI compute clusters.
High-Speed Optical Interconnects for Hyperscale Data Centers
Silicon photonic chips and 3D packaged optical engines enable data-center scale-out networks, delivering high-density, highly reliable, and energy-efficient optical connectivity among switches, servers, and compute nodes—continuously expanding network capacity and the compute frontier of hyperscale data centers.
Ecosystem Partners
About Nvision
Join Nvision
Meet Nvision team, as we are a young and dynamic team of top talents such as Tsinghua University, Peking University, Nanjing University, University of Science and Technology of China and Huazhong University of Science and Technology; we also have many years of industry experience developing high-volume photonic products in optical communications, LiDARs, 3D sensing fields. We serve globally prominent customers in data centers, servers, switches, and XPUs. "Advancing the Next Generation of Moore's Law Through Photonic-Electronic Integration"— we collaborate with industry partners to drive the next wave of Moore's Law.
Latest News
CIOE Preview｜Five Innovative Optical Interconnect Products from Nvision to Make Their Debut
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NVIDIA Declares CPO Has Entered Mass Production: How Can China’s CPO Industry Break Through?
Positioning for Next-Generation Optical Interconnects: Nvision Advances the Domestic Deployment of the COUPE Architecture
Join Us at CIOE, Unlock Next‑Gen Optical Interconnects
Meet at CIOE | A Feast of Optical Interconnect Awaits You
Building a Shared NPO Standards Ecosystem: Nvision Invited to the Inaugural Plenary Meeting of the Domestic NPO Standards Working Group
Industry Collaboration on High-Speed Interconnects for AI Computing Accelerates International Standardization of Near-Packaged Optics (NPO)