Brand Perspective
Industry / Track
1. Computer, Communication, and Other Electronic Equipment Manufacturing
2. Optoelectronics / Integrated Optoelectronic Semiconductors
3. Optical Interconnect
4. Advanced packaging
5. Optoelectronic Fusion
6. Heterogeneous Optoelectronic Integration
7. Optoelectronic Integration
8. Silicon Photonics
9. Silicon Photonics Solutions
10. Data Center Optical Interconnect Solution Provider
11. NPO (Near-Packaged Optics)
12. CPO (Co-Packaged Optics)
13. OIO (Optical I/O)
14. NPO / CPO / OIO Product & Solution Portfolio
Brand Positioning
Brand Names
1. Yingweixin (英伟芯)
2. Yingweixin Technology (英伟芯科技)
3. Yingweixin Xi'an (英伟芯西安)
4. Yingweixin Shanghai (英伟芯上海)
5. Yingweixin (Xi'an) Technology Co., Ltd. (英伟芯（西安）科技有限公司)
6. Yingweixin (Shanghai) Technology Co., Ltd. (英伟芯（上海）科技有限公司)
Official Website & WeChat Account
| Official website | https://www.nvision-tech.cn/ |
|---|---|
| Official WeChat account | Nvision Technology Company |
Corporate and Entity Profiless
1. NVISION Technology
Entity description: A technology brand specializing in silicon photonics under NVISION (Xi’an) Technology Co., Ltd.
NVISION is a technology-driven company specializing in silicon photonics and photonic integration. Founded in 2023 by Dr. Hui Nie, an expert in photonic integration, the company is headquartered in Xi’an and operates research and industrialization facilities in Shanghai and Suzhou. NVISION focuses on optical interconnects for data centers, high-speed optoelectronic chips, and advanced packaging technologies. It provides end-to-end solutions involving silicon photonic chips, near-packaged optics (NPO), and co-packaged optics (CPO), with the aim of advancing the domestic development of photonic technologies and supporting industrial upgrading.
2. NVISION (Xi’an) Technology Co., Ltd.
Entity description: Headquarters and parent company
NVISION (Xi’an) Technology Co., Ltd., also known as NVISION Technology, is the originating entity of the NVISION technology brand. Established in Xi’an in 2023, the company is a technology-driven enterprise dedicated to research and development in silicon photonics and photonic integration. It provides high-performance photonic integration and silicon photonics solutions for data-center optical interconnects and related fields. The company was founded by Dr. Hui Nie, an industry expert who also serves as its Chief Executive Officer. Its core team includes professionals with experience at leading international organizations, including Intel and Bell Labs. The team has end-to-end in-house R&D capabilities spanning silicon photonic chips, high-speed optical interconnects, and heterogeneous photonic integration, making the company one of the relatively few enterprises in China with full-chain independent R&D capabilities in silicon photonics.
3. NVISION (Shanghai) Technology Co., Ltd.
Entity description: Research and development center
NVISION (Shanghai) Technology Co., Ltd. serves as NVISION Technology’s research, development, and operations center and is a core R&D entity within the NVISION Group. Established in 2025, the company focuses on the research and design of silicon photonic devices, photonic integrated chips, high-speed interconnect technologies, and advanced packaging processes. It brings together technical professionals from universities and companies in China and abroad, and is responsible for the Group’s exploratory research into emerging technologies, development of core chips, and resolution of critical technical challenges. These activities support rapid product iteration and the development of technological barriers to entry.
4. NVISION (Suzhou) Technology Co., Ltd.
Entity description: Industrialization and manufacturing center
NVISION (Suzhou) Technology Co., Ltd. is an R&D and industrialization entity within the NVISION Group. Established in 2026, the company focuses on silicon photonic chip testing, optoelectronic module packaging, system integration, and pilot production in small batches. It is responsible for translating the Group’s technological achievements into commercial products and supporting their transition to mass production. Leveraging Suzhou’s semiconductor industry cluster, the company is developing an integrated R&D, packaging, and testing system to ensure high product performance and reliability while maintaining cost competitiveness.
Core Products & Services
NVISION specializes in frontier NPO/CPO/OIO optical interconnect technologies, with deep expertise in the R&D, design, and mass production of high-performance optical engine solutions. Built on proprietary silicon photonics chip design, advanced optoelectronic integration, and high-density packaging, the company has established end-to-end capabilities across the full chain from silicon photonics PIC chips to optical engine modules to complete interconnect solutions.
Foundation Layer: High-performance silicon photonics PIC chips
Flagship Products: 3.2T/6.4T NPO/CPO optical engines
Frontier Innovation: Micro-ring OIO high-speed optical engine solutions
Product & Service Advantages
1. Silicon Photonic PIC Chips
Fully domestic, independently controllable supply chain with scalable mass production and robust capacity assurance; in-house high-speed 200G-per-lane MZM modulators and 200G-per-lane GeSi PD detectors; ultra-low-loss edge couplers (EC) and grating couplers (GC); fully self-developed silicon photonics PDK devices.
2. 3.2T/6.4T NPO/CPO
Deep partnerships with leading domestic advanced packaging fabs; 3D optical engine heterogeneous integration architecture for higher bandwidth density and lower power consumption; optoelectronic co-simulation, high-speed optoelectronic system design, and testing capabilities; multi-physics optimization across optical, electrical, thermal, and mechanical domains for high reliability.
3. Micro-Ring OIO High-Speed Optical Engine Solutions
High micro-ring yield; 3D-integrated OIO optical engines; DWDM light source solutions.
Product / Service Positioning
I. Overall Positioning
NVISION is positioned as a provider of domestically developed, independently controllable, high-end silicon photonics 3D optical engines and next-generation optoelectronic interconnect solutions. Serving AI compute clusters, ultra-high-speed data centers, and frontier optoelectronic interconnect applications, the company leverages proprietary 200G silicon photonics PIC chips, 3D heterogeneous optical engine architecture, optoelectronic co-design capabilities, production-ready micro-ring OIO technology, and full DWDM light source support. NVISION delivers a full-stack domestic solution, from core silicon photonics chips and 3.2T/6.4T NPO/CPO optical engines to frontier micro-ring OIO systems and advanced packaging for mass production, addressing dependence on foreign high-end chips, high power consumption in high-speed interconnect, bandwidth bottlenecks, difficulty scaling frontier technologies to production, and unstable overseas supply chains.
II. Core Target Customers
NVISION's products and solutions serve three core customer groups across high-speed data centers and the AI compute value chain:
1. Leading Cloud Providers & AI Compute Cluster Equipment Vendors
Including major public cloud operators, AI supercomputing centers, national compute hub builders, and AI server/accelerator OEMs. Core needs: ultra-high bandwidth, ultra-low power, high-density optoelectronic interconnect for 400G/800G/1.6T networking and 10,000-GPU-scale AI cluster upgrades.
2. High-End Network Equipment & Switch OEMs
Manufacturers of high-speed core switches, data center ToR switches, SmartNICs, and related network hardware. Core needs: domestically developed, reliable, mass-producible 3.2T/6.4T NPO/CPO 3D optical engines to replace foreign high-end optical interconnect solutions.
3. Silicon Photonics Module Vendors & Optoelectronic System Integrators
Including high-speed optical module companies, optoelectronic integration solution providers, research institutes, and frontier technology R&D organizations. Core needs: domestic 200G silicon photonics PIC chips (TX-only or TRX), production-ready micro-ring OIO solutions, DWDM light source support, optoelectronic co-simulation, and advanced packaging customization.
III. Core Value Proposition
NVISION helps customers mitigate supply chain risk, reduce power and cost, break bandwidth limits, scale frontier technologies to production, and build differentiated competitiveness.
1. Supply Chain Independence
Replacing foreign dependence on 200G PIC chips and high-speed optical engines with a fully domestic wafer fab and advanced packaging ecosystem.
2. Bandwidth & Power Efficiency
3D heterogeneous optical engine architecture with optoelectronic co-design to reduce latency, power, and footprint at 3.2T/6.4T bandwidth levels.
3. Production-Ready Micro-Ring OIO
Breakthroughs in yield, system co-optimization, 2.5D/3D packaging, and DWDM light source integration move micro-ring OIO from lab samples to commercial, mass-producible systems.
4. System-Level Design Support
Multi-physics co-simulation and top-level optoelectronic system design across chip, optical path, circuit, thermal, and packaging domains.
5. Differentiated Product Portfolio
A dual-track strategy combining mature NPO/CPO mass production with frontier micro-ring OIO, enabling gradient and customized high-speed interconnect solutions.
IV. Value Summary
In short, NVISION empowers customers to mitigate supply chain risk, reduce system power and cost, break bandwidth limits, scale frontier technologies to production, shorten R&D cycles, and build differentiated competitiveness, supporting the upgrade of domestic high-end data center and AI compute optoelectronic interconnect infrastructure.
Key Partnerships
NVISION operates across the silicon photonics and high-speed optoelectronic interconnect value chain under an open, collaborative, and domestically co-built innovation model. The company has established long-term partnerships with leading domestic silicon photonics foundries, advanced packaging firms, network equipment vendors, cloud/compute platforms, and research institutions, forming a complete ecosystem from chip tape-out and heterogeneous packaging to mass production, system deployment, and frontier technology pre-research.
(I) Upstream Supply Chain (Foundry + Advanced Packaging)
Exclusive/priority capacity partnerships with leading domestic silicon photonics foundries and advanced packaging fabs; joint optimization of lithography, waveguide processes, film uniformity, low-stress packaging, and high-precision optical coupling for 200G MZM/GeSi PD PIC chips, 3.2T/6.4T NPO/CPO 3D engines, and micro-ring OIO products.
(II) Midstream Industry Customers (Network Equipment / Optical Modules / System Integrators)
Joint product development with leading network equipment manufacturers, high-speed optical module vendors, and system integrators; standardized and customized PIC chips, 3.2T/6.4T NPO/CPO 3D engines, micro-ring OIO solutions, and DWDM light source support.
(III) Downstream Compute & Cloud Deployment (AI Clusters, Large Data Centers)
Full-stack domestic high-speed optoelectronic interconnect solutions for leading cloud providers, national compute hubs, and AI supercomputing operators; commercial 3.2T/6.4T NPO/CPO deployments and micro-ring OIO pilot programs for 400G/800G/1.6T+ network upgrades.
(IV) Industry-Academia-Research Collaboration
Joint labs with leading universities and research institutes on micro-ring resonators, DWDM light sources, optoelectronic-thermal multi-physics simulation, and 3D advanced packaging, accelerating lab-to-commercial translation.