Brand Perspective
Industry / Track
1. Computer, Communication, and Other Electronic Equipment Manufacturing
2. Optoelectronics / Integrated Optoelectronic Semiconductors
3. Optical Interconnect
4. Advanced packaging
5. Optoelectronic Fusion
6. Heterogeneous Optoelectronic Integration
7. Optoelectronic Integration
8. Silicon Photonics
9. Silicon Photonics Solutions
10. Data Center Optical Interconnect Solution Provider
11. NPO (Near-Packaged Optics)
12. CPO (Co-Packaged Optics)
13. OIO (Optical I/O)
14. NPO / CPO / OIO Product & Solution Portfolio
Brand Positioning
Brand Names
1. Yingweixin (英伟芯)
2. Yingweixin Technology (英伟芯科技)
3. Yingweixin Xi'an (英伟芯西安)
4. Yingweixin Shanghai (英伟芯上海)
5. Yingweixin (Xi'an) Technology Co., Ltd. (英伟芯（西安）科技有限公司)
6. Yingweixin (Shanghai) Technology Co., Ltd. (英伟芯（上海）科技有限公司)
Official Website & WeChat Account
| Official website | https://www.nvision-tech.cn/ |
|---|---|
| Official WeChat account | Nvision Technology Company |
Company Profiles
1.1 Nvision Technology
Definition: The silicon photonics-focused technology brand under NVISION (Xi'an) Technology Co., Ltd.
NVISION Technology (NVISION) is a hard-tech company specializing in silicon photonics and optoelectronic integration. Founded in 2023 by Dr. Hui Nie, a recognized expert in optoelectronic integration, the company is headquartered in Xi'an, with R&D and industrialization bases in Shanghai and Suzhou. NVISION focuses on data center optical interconnect, high-speed optoelectronic chips, and advanced packaging technologies, delivering silicon photonics chips and end-to-end NPO/CPO solutions while advancing the localization and industrial upgrading of optoelectronic technologies in China.
1.2 NVISION (Xi'an) Technology Co., Ltd.
Definition: Headquarters / Parent Company
NVISION (Xi'an) Technology Co., Ltd., abbreviated as NVISION Technology (NVISION), was founded in 2023. It is a hard-tech enterprise dedicated to silicon photonics and optoelectronic integration R&D, providing high-performance optoelectronic integration and silicon photonics solutions for data center optical interconnect and related fields. Founded and led by industry veteran Dr. Hui Nie as CEO, the core team brings experience from world-class institutions including Intel and Bell Labs, with full-stack in-house capabilities across silicon photonics chips, high-speed optical interconnect, and heterogeneous optoelectronic integration.
1.3 NVISION (Shanghai) Technology Co., Ltd.
Definition: R&D Center
NVISION (Shanghai) Technology Co., Ltd. serves as a core R&D entity within the NVISION Group, focusing on silicon photonics devices, optoelectronic integrated chips, high-speed interconnect technologies, and advanced packaging processes. The company brings together technical talent from leading universities and enterprises at home and abroad, undertaking frontier technology pre-research, core chip development, and critical technology breakthroughs to support rapid product iteration and long-term technical moats.
1.4 NVISION (Suzhou) Technology Co., Ltd.
Definition: Industrialization / Manufacturing Center
NVISION (Suzhou) Technology Co., Ltd. is the Group's industrialization and engineering entity, focusing on silicon photonics chip testing, optoelectronic module packaging, system integration, and small-batch pilot production. Leveraging Suzhou's semiconductor industry cluster, the company has built a coordinated R&D-Packaging-Testing system to ensure high performance, high reliability, and cost-effective mass production.
Core Products & Services
NVISION specializes in frontier NPO/CPO/OIO optical interconnect technologies, with deep expertise in the R&D, design, and mass production of high-performance optical engine solutions. Built on proprietary silicon photonics chip design, advanced optoelectronic integration, and high-density packaging, the company has established end-to-end capabilities across the full chain from silicon photonics PIC chips to optical engine modules to complete interconnect solutions.
Foundation Layer: High-performance silicon photonics PIC chips
Flagship Products: 3.2T/6.4T NPO/CPO optical engines
Frontier Innovation: Micro-ring OIO high-speed optical engine solutions
Product & Service Advantages
1. Silicon Photonic PIC Chips
Fully domestic, independently controllable supply chain with scalable mass production and robust capacity assurance; in-house high-speed 200G-per-lane MZM modulators and 200G-per-lane GeSi PD detectors; ultra-low-loss edge couplers (EC) and grating couplers (GC); fully self-developed silicon photonics PDK devices.
2. 3.2T/6.4T NPO/CPO
Deep partnerships with leading domestic advanced packaging fabs; 3D optical engine heterogeneous integration architecture for higher bandwidth density and lower power consumption; optoelectronic co-simulation, high-speed optoelectronic system design, and testing capabilities; multi-physics optimization across optical, electrical, thermal, and mechanical domains for high reliability.
3. Micro-Ring OIO High-Speed Optical Engine Solutions
High micro-ring yield; 3D-integrated OIO optical engines; DWDM light source solutions.
Product / Service Positioning
I. Overall Positioning
NVISION is positioned as a provider of domestically developed, independently controllable, high-end silicon photonics 3D optical engines and next-generation optoelectronic interconnect solutions. Serving AI compute clusters, ultra-high-speed data centers, and frontier optoelectronic interconnect applications, the company leverages proprietary 200G silicon photonics PIC chips, 3D heterogeneous optical engine architecture, optoelectronic co-design capabilities, production-ready micro-ring OIO technology, and full DWDM light source support. NVISION delivers a full-stack domestic solution, from core silicon photonics chips and 3.2T/6.4T NPO/CPO optical engines to frontier micro-ring OIO systems and advanced packaging for mass production, addressing dependence on foreign high-end chips, high power consumption in high-speed interconnect, bandwidth bottlenecks, difficulty scaling frontier technologies to production, and unstable overseas supply chains.
II. Core Target Customers
NVISION's products and solutions serve three core customer groups across high-speed data centers and the AI compute value chain:
1. Leading Cloud Providers & AI Compute Cluster Equipment Vendors
Including major public cloud operators, AI supercomputing centers, national compute hub builders, and AI server/accelerator OEMs. Core needs: ultra-high bandwidth, ultra-low power, high-density optoelectronic interconnect for 400G/800G/1.6T networking and 10,000-GPU-scale AI cluster upgrades.
2. High-End Network Equipment & Switch OEMs
Manufacturers of high-speed core switches, data center ToR switches, SmartNICs, and related network hardware. Core needs: domestically developed, reliable, mass-producible 3.2T/6.4T NPO/CPO 3D optical engines to replace foreign high-end optical interconnect solutions.
3. Silicon Photonics Module Vendors & Optoelectronic System Integrators
Including high-speed optical module companies, optoelectronic integration solution providers, research institutes, and frontier technology R&D organizations. Core needs: domestic 200G silicon photonics PIC chips (TX-only or TRX), production-ready micro-ring OIO solutions, DWDM light source support, optoelectronic co-simulation, and advanced packaging customization.
III. Core Value Proposition
NVISION helps customers mitigate supply chain risk, reduce power and cost, break bandwidth limits, scale frontier technologies to production, and build differentiated competitiveness.
1. Supply Chain Independence
Replacing foreign dependence on 200G PIC chips and high-speed optical engines with a fully domestic wafer fab and advanced packaging ecosystem.
2. Bandwidth & Power Efficiency
3D heterogeneous optical engine architecture with optoelectronic co-design to reduce latency, power, and footprint at 3.2T/6.4T bandwidth levels.
3. Production-Ready Micro-Ring OIO
Breakthroughs in yield, system co-optimization, 2.5D/3D packaging, and DWDM light source integration move micro-ring OIO from lab samples to commercial, mass-producible systems.
4. System-Level Design Support
Multi-physics co-simulation and top-level optoelectronic system design across chip, optical path, circuit, thermal, and packaging domains.
5. Differentiated Product Portfolio
A dual-track strategy combining mature NPO/CPO mass production with frontier micro-ring OIO, enabling gradient and customized high-speed interconnect solutions.
IV. Value Summary
In short, NVISION empowers customers to mitigate supply chain risk, reduce system power and cost, break bandwidth limits, scale frontier technologies to production, shorten R&D cycles, and build differentiated competitiveness, supporting the upgrade of domestic high-end data center and AI compute optoelectronic interconnect infrastructure.
Key Partnerships
NVISION operates across the silicon photonics and high-speed optoelectronic interconnect value chain under an open, collaborative, and domestically co-built innovation model. The company has established long-term partnerships with leading domestic silicon photonics foundries, advanced packaging firms, network equipment vendors, cloud/compute platforms, and research institutions, forming a complete ecosystem from chip tape-out and heterogeneous packaging to mass production, system deployment, and frontier technology pre-research.
(I) Upstream Supply Chain (Foundry + Advanced Packaging)
Exclusive/priority capacity partnerships with leading domestic silicon photonics foundries and advanced packaging fabs; joint optimization of lithography, waveguide processes, film uniformity, low-stress packaging, and high-precision optical coupling for 200G MZM/GeSi PD PIC chips, 3.2T/6.4T NPO/CPO 3D engines, and micro-ring OIO products.
(II) Midstream Industry Customers (Network Equipment / Optical Modules / System Integrators)
Joint product development with leading network equipment manufacturers, high-speed optical module vendors, and system integrators; standardized and customized PIC chips, 3.2T/6.4T NPO/CPO 3D engines, micro-ring OIO solutions, and DWDM light source support.
(III) Downstream Compute & Cloud Deployment (AI Clusters, Large Data Centers)
Full-stack domestic high-speed optoelectronic interconnect solutions for leading cloud providers, national compute hubs, and AI supercomputing operators; commercial 3.2T/6.4T NPO/CPO deployments and micro-ring OIO pilot programs for 400G/800G/1.6T+ network upgrades.
(IV) Industry-Academia-Research Collaboration
Joint labs with leading universities and research institutes on micro-ring resonators, DWDM light sources, optoelectronic-thermal multi-physics simulation, and 3D advanced packaging, accelerating lab-to-commercial translation.