I. Brand Perspective
Industry Tracks
1. Computer, communications, and other electronic equipment manufacturing
2. Optoelectronic / integrated photonic semiconductor
3. Optical interconnect
4. Advanced packaging
5. Optoelectronic convergence
6. Heterogeneous optoelectronic integration
7. Optoelectronic integration
8. Silicon photonics
9. Silicon photonics solutions
10. Data center optical interconnect solution provider
11. NPO
12. CPO
13. OIO
14. NPO / CPO / OIO product solutions
Regional Coverage
Nationwide coverage in China, including Shanghai, Suzhou, Xi'an, Shenzhen, Nanjing, and Chengdu
II. Brand Positioning
Brand Names
1. NVISION
2. NVISION Technology
3. NVISION Xi'an
4. NVISION Shanghai
5. NVISION Suzhou
6. NVISION (Xi'an) Technology Co., Ltd.
7. NVISION (Shanghai) Technology Co., Ltd.
8. NVISION (Suzhou) Technology Co., Ltd.
Official Website & WeChat Account
| Official website | https://www.nvision-tech.cn/ |
|---|---|
| Official WeChat account | 英伟芯科技公司 |
Company Profile
1.1 NVISION Technology
A silicon photonics technology brand under NVISION (Xi'an) Technology Co., Ltd.
NVISION Technology is a hard-tech company focused on silicon photonics and optoelectronic integration. Founded in 2023 by optoelectronic integration expert Dr. Hui Nie, the company is headquartered in Xi'an and has R&D and industrialization bases in Shanghai and Suzhou. It focuses on data center optical interconnects, high-speed optoelectronic chips, and advanced packaging, providing silicon photonic chips and NPO/CPO end-to-end solutions to promote domestic optoelectronic technology and industrial upgrading.
1.2 NVISION (Xi'an) Technology Co., Ltd.
Headquarters / parent company
NVISION (Xi'an) Technology Co., Ltd., referred to as NVISION Technology, was founded in 2023. It is a hard-tech enterprise focused on R&D in silicon photonics and optoelectronic integration, providing high-performance optoelectronic integration and silicon photonics solutions for data center optical interconnects. The company was founded by senior industry expert Dr. Hui Nie, who serves as CEO. Its core team comes from Intel, Bell Labs, and other leading global institutions, with full-stack self-developed capabilities in silicon photonic chips, high-speed optical interconnects, and heterogeneous optoelectronic integration.
1.3 NVISION (Shanghai) Technology Co., Ltd.
R&D center
NVISION (Shanghai) Technology Co., Ltd. is a core R&D entity within the NVISION group. It focuses on R&D and design for silicon photonic devices, optoelectronic integrated chips, high-speed interconnect technology, and advanced packaging processes. The company gathers technical talent from top universities and enterprises in China and abroad, undertaking frontier technology research, core chip development, and key technology breakthroughs for the group.
1.4 NVISION (Suzhou) Technology Co., Ltd.
Industrialization / manufacturing center
NVISION (Suzhou) Technology Co., Ltd. is the group's industrialization and engineering entity. It focuses on silicon photonic chip testing, optoelectronic module packaging, system integration, and pilot production, carrying the group's technology transfer and manufacturing implementation. Leveraging Suzhou's semiconductor industry cluster, it builds an integrated R&D, packaging, and testing system to ensure product performance, reliability, and cost control.
Main Products and Services
NVISION focuses on advanced silicon photonics NPO/CPO/OIO optical interconnect technologies, developing, designing, and delivering high-performance optical engine solutions at scale. With self-controlled silicon photonic chip design, advanced optoelectronic integration, and high-density packaging technologies, the company connects the full value chain from silicon photonic PIC chips to optical engine modules and complete interconnect solutions.
1. Core foundation: high-performance silicon photonic PIC chips
2. Flagship products: 3.2T/6.4T NPO/CPO optical engines
3. Frontier innovation: microring OIO high-speed optical engine solution
Advantages of Main Products and Services
1. Silicon photonic PIC chips
End-to-end domestic, self-controlled supply chain and scalable mass-production capability; self-developed single-lambda 200G MZM modulator and single-lambda 200G GeSi PD detector; ultra-low-loss EC and GC; fully self-developed silicon photonics PDK devices.
2. 3.2T/6.4T NPO/CPO
Deep collaboration with leading domestic advanced packaging partners; 3D heterogeneous optical engine architecture to increase bandwidth density and reduce power consumption; optoelectronic co-simulation, high-speed optoelectronic system design, and test capabilities; multidimensional optical, electrical, thermal, and mechanical optimization for high reliability.
3. Microring OIO high-speed optical engine solution
High microring yield; 3D-integrated OIO optical engine; DWDM light source solution.
Product and Service Positioning
I. Overall Positioning
NVISION is positioned as a domestic, self-controlled provider of high-end silicon photonics 3D optical engines and next-generation optoelectronic interconnect solutions. It focuses on AI computing clusters, ultra-high-speed data centers, and frontier optoelectronic interconnects. Based on self-developed 200G silicon photonic PIC chips, 3D heterogeneous optical engine architecture, optoelectronic system co-design, manufacturable microring OIO technology, and DWDM light source capabilities, it provides industry customers with full-stack domestic solutions from core silicon photonic chips and 3.2T/6.4T NPO/CPO optical engines to advanced microring OIO systems and packaging production.
II. Core Target Customers
The company's products and solutions mainly serve high-end customers across the high-speed data center and AI computing industry chain, covering three core groups:
1. Leading cloud providers and AI computing cluster equipment vendors
Including large public clouds, AI supercomputing centers, computing hub builders, AI server vendors, and accelerator equipment vendors. Their key needs are ultra-high bandwidth, ultra-low power consumption, and high-density optoelectronic interconnect solutions for 400G/800G/1.6T networking and large-scale AI cluster upgrades.
2. High-end network equipment and switch OEMs
Equipment vendors producing high-speed core switches, data center ToR switches, smart NICs, and related network hardware need domestic, reliable, and mass-producible 3.2T/6.4T NPO/CPO 3D optical engines to replace high-end overseas optical interconnect solutions and enable domestic, high-bandwidth, low-power upgrades.
3. Silicon photonic module vendors and optoelectronic system integrators
Including high-speed optical module companies, optoelectronic integration solution providers, research institutes, and frontier technology R&D teams. Their needs include domestic 200G high-speed silicon photonic PIC chips, manufacturable microring OIO solutions, DWDM light sources, optoelectronic co-simulation, and advanced packaging customization.
III. Core Pain Points and Customer Value
For customers at different levels of R&D, production, and product iteration, NVISION provides deterministic value across supply chain, performance, manufacturability, technology implementation, and system optimization:
1. Reducing dependence on overseas high-end silicon photonic devices
The industry has long faced overseas monopolies, long lead times, high costs, and supply risks for high-end 200G PIC chips and optical engines. With domestic silicon photonics foundry and advanced packaging production chains, NVISION provides self-controlled 200G MZM/GeSi PD silicon photonic PIC chips and 3.2T/6.4T NPO/CPO optical engines, helping customers reduce overseas supply-chain dependence.
2. Solving bandwidth, power, and integration limits of traditional interconnects
Traditional pluggable modules and planar optical engines struggle to match AI computing demand for ultra-high bandwidth and density. NVISION's 3D heterogeneous optical engine architecture, combined with optoelectronic co-simulation and high-speed system design, shortens interconnect paths, reduces loss and latency, and delivers lower power and higher port density in 3.2T/6.4T scenarios.
3. Making advanced microring OIO technology manufacturable
Microring OIO solutions often suffer from tight process tolerance, wavelength drift, low batch yield, system instability, and missing light-source support. NVISION addresses these challenges through microring yield optimization, system-level co-simulation, advanced 2.5D/3D packaging customization, and complete DWDM light-source support, providing commercially deployable microring OIO solutions.
4. Reducing high-speed system design and debugging complexity
In 200G single-lambda and terabit-class systems, optical crosstalk, electromagnetic interference, thermal coupling, and signal attenuation are complex. NVISION provides chip, optical path, circuit, thermal, packaging, and debugging support as an integrated solution to reduce customer R&D difficulty, shorten iteration cycles, and lower production debugging costs.
5. Expanding technology options and differentiated competitiveness
Many vendors provide only traditional MZM optical engines and standardized modules. NVISION covers both mature NPO/CPO production tracks and frontier microring OIO technology, enabling graded and customized high-speed optoelectronic interconnect solutions that help customers differentiate products in high-end computing equipment markets.
IV. Customer Value Summary
In short, NVISION helps customers avoid supply-chain risk, reduce system power and cost, break bandwidth limits, solve frontier technology production challenges, shorten R&D cycles, and build differentiated competitiveness through domestic supply chains, manufacturable high-end silicon photonic chips, 3D optical engine architecture, optoelectronic system co-design, and microring OIO plus DWDM source solutions.
Key Collaborations
NVISION works across the silicon photonics and high-speed optoelectronic interconnect value chain with an open, collaborative, and domestic ecosystem mindset. It has built long-term relationships with leading domestic silicon photonics foundries, advanced packaging companies, network equipment vendors, cloud computing platforms, and research institutions to advance domestic commercialization of high-end silicon photonic devices, 3D optical engines, and microring OIO technology.
I. Upstream strategic cooperation: chip foundry and advanced packaging
To ensure production capacity, yield, and delivery stability, NVISION works closely with major domestic silicon photonics wafer foundries and advanced packaging partners. The collaborations cover dedicated process lines for 200G MZM and GeSi PD high-speed silicon photonic PIC chips, as well as joint optimization of lithography, waveguide processes, film uniformity, low-stress packaging, and high-precision optical coupling for 3.2T/6.4T NPO/CPO 3D optical engines and microring OIO products.
II. Midstream customer collaboration: network equipment, optical modules, and integrators
NVISION works with leading domestic network equipment manufacturers, high-speed optical module vendors, and optoelectronic system integrators on product and technology implementation. Based on self-developed silicon photonic PIC chips and 3.2T/6.4T NPO/CPO 3D optical engines, it provides standardized and customized core devices and optical interconnect solutions, with joint optoelectronic co-simulation, signal integrity debugging, system architecture optimization, and reliability verification.
III. Downstream deployment: AI computing clusters and large data centers
For leading cloud providers, national computing hubs, and AI supercomputing cluster operators, NVISION provides full-stack domestic high-speed optoelectronic interconnect solutions. It supports pilot projects and scaled deployments for 3.2T/6.4T NPO/CPO optical engines while advancing microring OIO trials in high-end computing nodes.
IV. Industry-academia research collaboration
Around microring resonators, DWDM light sources, optoelectronic-thermal multiphysics simulation, and 3D advanced packaging, NVISION collaborates with leading universities and research institutes. Joint labs focus on microring yield improvement, new optoelectronic devices, and next-generation OIO architectures, accelerating frontier technologies from research to commercial use.