As CIOE 2026 drew to a close, NVISION Technology made its first appearance with five self-developed products, presenting a focused product lineup spanning PICs, NPO/CPO, and OIO. Throughout the exhibition, the NVISION booth drew many customers and industry partners, with lively discussions on product technologies, application needs, and collaboration opportunities.

[Figure] NVISION booth at CIOE

Targeting next-generation AI computing infrastructure, NVISION focuses on silicon photonic chips, optoelectronic integration, and high-speed optical interconnect, continuously advancing R&D around high data rates, high bandwidth density, and high integration. The five products showcased at the event reflect the company’s technical exploration for high-speed optical modules, supernode interconnect, and Optical I/O applications.

Three Product Directions on Display

At this exhibition, NVISION presented a product matrix built around PICs, NPO/CPO optical engines, and OIO chiplets, covering optical modules, supernode interconnect, and next-generation Optical I/O applications.

[Figure] NVISION product matrix

1.6T DR8 Silicon Photonic Chip: High-Speed Transmission for 1.6T Optical Modules

NVISION’s 1.6T silicon photonic transmitter chip adopts a high-performance MZM modulation architecture, supporting a single-wavelength data rate of 224 Gbps and 500 m single-mode transmission in the 1310 nm band.

Combining high bandwidth, low insertion loss, and high integration, the product provides a key chip solution for 1.6T DR8 optical modules, addressing the transmission performance and integration requirements of high-speed optical interconnect.

[Figure] NVISION 1.6T DR8 silicon photonic chip

3.2T NPO Silicon Photonic Chip: For Scale-Up Supernode Optical Interconnect

The 3.2T NPO silicon photonic chip integrates 16-channel TX and RX. Based on a high-performance MZM modulation architecture and high-bandwidth photodetectors (PDs), it supports 112 Gbps PAM4 high-speed transmission and external light-source input.

Featuring an Edge Coupler optical interface and flip-chip packaging, the product supports passive coupling and meets OIF protocol standards, providing a chip solution for 3.2T NPO products targeting scale-up supernode optical interconnect.

[Figure] NVISION 3.2T NPO silicon photonic chip

6.4T CPO Optical Engine: Advanced Packaging for High Optoelectronic Integration

The 6.4T CPO optical engine integrates 16-channel TX and RX. Through co-integration of PIC and EIC, it supports single-channel 224 Gbps PAM4 high-speed transmission.

Using 3D advanced packaging and an Edge Coupler optical interface, the product supports passive coupling and addresses 6.4T NPO/CPO application needs, demonstrating NVISION’s capabilities in high-speed transceiver design and optoelectronic integration.

[Figure] NVISION 6.4T CPO optical engine

WDM Light-Source Chip: Stable Multi-Wavelength Optical Carrier Support

The WDM light-source chip uses heterogeneous integration to combine multi-wavelength sources in the 1310 nm / 1330 nm bands, supporting 8-wavelength output within a single band and scalable to 16 channels and beyond.

With multi-wavelength integration, high-power stable optical output, and excellent temperature stability, the product meets high-speed optical interconnect systems’ requirements for optical-carrier quality, reliability, and long-term stable operation.

[Figure] NVISION WDM light-source chip

OIO Optical Engine: For Next-Generation High-Bandwidth-Density Optical Interconnect

The OIO optical engine adopts 3D advanced packaging, integrating PIC and EIC with TX and RX functions, and supports 8+8 wavelength-division multiplexing in the 1310 nm / 1330 nm bands.

Combining optoelectronic integration with multi-wavelength transmission, the product targets next-generation high-bandwidth-density scale-up optical interconnect needs and showcases NVISION’s product roadmap for Optical I/O applications.

[Figure] NVISION OIO microring test chip

Connecting Technology and Applications

From product briefings at the booth to in-depth technical discussions, CIOE gave NVISION a face-to-face forum with customers and industry partners. Around concrete products and application requirements, the team presented technical solutions, listened to customer feedback, and explored opportunities for follow-up engagement and collaboration.

[Figure] On-site exchanges at the NVISION CIOE booth

Building on talent and technical strengths in silicon photonic devices, high-speed circuits, advanced packaging, test and validation, and system applications, NVISION will continue to advance key technology R&D and industrialization, strengthen collaboration across chip design, optoelectronic integration, packaging and testing, and system applications, and deliver critical chip and optoelectronic integration solutions for next-generation AI computing infrastructure.

The Conversation Continues

We thank every customer, partner, industry peer, media outlet, and investment institution who visited our booth.

Our first CIOE journey has come to a close, but conversations on products, technologies, and applications continue. Please contact us for product materials, to schedule a technical exchange, or to discuss application requirements further.

Driving light with silicon — powering the next leap in computing.