Source: WeChat Official Account article by NVision Technology
Original URL: https://mp.weixin.qq.com/s/aLBeMx4HWno-hs2LJ7b6bQ
About the Global Computing Consortium (GCC)
The Global Computing Consortium (GCC) is jointly initiated by technology providers, manufacturers, system integrators, enterprise users, and research institutes in the computing sector. It is dedicated to advancing open innovation across the computing industry, building a robust and prosperous ecosystem, and supporting the sustainable development of a digital and intelligent society.
NVision Joins GCC
NVision Technology has officially joined the GCC. Leveraging core capabilities in silicon photonics and advanced packaging, NVision brings optical interconnect into the next phase of “Moore’s Law” and delivers end-to-end product solutions. The company has established three major product lines: silicon photonic integrated circuits (PICs), near-package optics (NPO) chips, and co-packaged optics (CPO) / optical I/O (OIO) optical engine solutions.
Following its accession to the GCC, NVision plans to engage deeply in the High-Speed Interconnect Working Group of the Open AI Infra community, contribute China-developed solutions to CPO/NPO optical interconnect technical specifications and testing benchmarks, and participate in drafting related industry/association standards—thereby helping advance the standardization of optical interconnect for domestic AI computing infrastructure.
Company Overview
NVision Technology is a global photoelectric integration company providing high-speed optical interconnect solutions for next-generation AI computing centers. Building on strengths in silicon photonics, advanced packaging, and heterogeneous photonic–electronic integration, the company offers a full stack of products and solutions, including silicon photonic chips, end-to-end NPO/CPO optical engines, and next-generation wavelength-division multiplexing (WDM) micro-ring modulator OIO light sources and optical engines. As of 2026, NVision has completed financing on the order of hundreds of millions of RMB.
01 Corporate Development History
[The original WeChat post presents this section primarily through visual timelines/images; no additional body text was available for translation.]
02 Core Products
1.6T Silicon Photonic Transmitter Chip (DR8)
The 1.6T silicon photonic transmitter chip (DR8) is based on a high-performance Mach–Zehnder modulator (MZM) architecture and delivers a per-wavelength data rate of 224 Gbps. The product supports 500 m single-mode transmission in the 1310 nm band and features high bandwidth, low insertion loss, and high integration density, making it well suited to 1.6T optical module applications.
Key advantages: high-performance 1.6T PIC; fully domestic supply chain; low optical loss; high-speed single-wavelength 224G.
3.2T Silicon Photonic Chip
This 16-channel TX/RX integrated silicon photonic chip combines a high-performance MZM architecture with high-bandwidth photodetectors (PDs). It supports 112 Gbps PAM4 high-speed transmission and external light-source input, adopts an edge-coupler optical interface with flip-chip packaging, enables passive coupling, and complies with OIF protocol standards. The chip provides a solution path for 3.2T NPO products and is designed for scale-up ultra-node optical interconnect.
Key advantages: transceiver-integrated PIC; high-integration flip-chip packaging; high bandwidth and low power; optimized 3.2T NPO solution.
6.4T NPO Optical Engine
This 16-channel TX/RX integrated optical engine (PIC + EIC) supports per-channel 224 Gbps PAM4 high-speed transmission. It uses an edge coupler for passive coupling, conforms to mainstream standards (UPO / DORA / OPENCPX), and employs 3D advanced packaging for a high level of integration, meeting application requirements for 6.4T NPO/CPO products.
Key advantages: high bandwidth-density integrated OE optical engine; ultra-compact form factor; 3D advanced packaging; support for high-density UPO / DORA / OPENCPX standards.
Micro-Ring Test Chip
This multi-channel micro-ring modulator (MRM) photonic integrated engine is fabricated with advanced silicon photonic processes. It densely integrates micro-ring modulators, waveguides, multiplexing/demultiplexing structures, high-speed interconnect interfaces, and control circuitry to enable multi-channel high-speed optical signal modulation. Micro-ring-based WDM PICs offer small device footprint, low drive voltage, and high integration density, effectively increasing port density in optical interconnect systems and providing a critical chip-level solution for next-generation Tbps-class optical communications.
Key advantages: high integration density; multi-channel WDM; 3D advanced packaging; next-generation OIO.
03 News Highlights
“Interconnect has become the bottleneck for next-generation AI computing. Using optical-engine I/O to interconnect computing and memory chips—and reducing latency and power through photonic–electronic integration—has become a key priority for computing-network R&D under China’s 15th Five-Year Plan. OIO (Optical I/O) will necessarily be a heterogeneous, multi-material integrated form of optical interconnect—reconstructing optical interconnect with a semiconductor Moore’s-Law mindset.” — Dr. Hui Nie, Founder of NVision Technology
Related interview: “Exclusive Interview with NVision’s Hui Nie: Photonic–Electronic Integration—China’s Answer to the Next Moore’s Law”
https://www.nvision-tech.cn/media/2097498156743921664
Mr. Nie further emphasized that NVision will proceed in a grounded, iterative manner—advancing alongside the industry chain through silicon photonics and photonic–electronic co-packaging—to prepare for the next surge in optical interconnect demand. Anchored in a fully domestic supply chain, the company actively collaborates with domestic foundries on development and tape-outs, pursuing localization in high-end 1.6T and NPO chip domains. As domestic AI clusters scale rapidly, NVision will accelerate product iteration and volume ramp-up to better serve customers.
Related interview: “Exclusive Interview with NVision’s Hui Nie: Anchored in a Fully Domestic Supply Chain, Preparing for the Optical Interconnect Boom in AI Clusters”
https://www.nvision-tech.cn/media/2097663169068666880
04 GCC Ecosystem Collaboration
NVision Technology is a China-based silicon-photonics and photonic–electronic integration company providing a full portfolio of high-speed optical engines—NPO, CPO, and OIO—for AI computing centers. It plans to join the High-Speed Interconnect Working Group of the Open AI Infra community; contribute China-developed solutions to CPO/NPO optical interconnect specifications and testing benchmarks; engage leading GPU and cloud service provider (CSP) customers; and participate in drafting optical interconnect association standards to promote adoption of standards for domestic AI computing infrastructure. The company will also deliver technical talks and product showcases at flagship events such as the Global Computing Conference (CGC) to increase industry visibility.
05 Learn More
Visit the NVision Technology official website (scan the QR code in the original post or visit the company site).
Company website: https://www.nvision-tech.cn/
